MC100LE310 datasheet(5/6 Pages) ONSEMI

tên linh kiện	MC100LE310

Giải thích chi tiết về linh kiện	LOW VOLTAGE 2:8 DIFFERENTIAL FANOUT BUFFER

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MC100LVE310 MC100E310

4–5

MOTOROLA

ECLinPS and ECLinPS Lite

DL140 — Rev 3

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180)

T L –M S

N S

M

0.007 (0.180)

T L –M S

N S

M

0.007 (0.180)

T L –M S

N S

M

0.010 (0.250)

T L –M S

N S

S

0.007 (0.180)

T L –M S

N S

M

0.010 (0.250)

T L –M S

N S

S

0.007 (0.180)

T L –M S

N S

M

0.007 (0.180)

T L –M S

N S

M

0.004 (0.100)

SEATING

PLANE

-T-

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

1.07

—

2

°

10.42

1.02

12.57

4.57

2.79

0.48

0.81

—

11.58

1.21

1.42

0.50

10

°

10.92

—

1.27 BSC

A

B

C

E

F

G

H

J

K

R

U

V

W

X

Y

Z

G1

K1

MIN

MAX

INCHES

MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS

PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED

AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.

ALLOWABLE MOLD FLASH IS 0.010 (0.250)

PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN

THE PACKAGE BOTTOM BY UP TO 0.012

(0.300). DIMENSIONS R AND U ARE

DETERMINED AT THE OUTERMOST

EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR

BURRS, GATE BURRS AND INTERLEAD

FLASH, BUT INCLUDING ANY MISMATCH

BETWEEN THE TOP AND BOTTOM OF THE

PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037

(0.940). THE DAMBAR INTRUSION(S) SHALL

NOT CAUSE THE H DIMENSION TO BE

SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.042

—

2

°

0.410

0.040

0.495

0.180

0.110

0.019

0.032

—

0.456

0.048

0.056

0.020

10

°

0.430

—

0.050 BSC

-N-

Y BRK

D

W

-M-

-L-

28

1

V

G1

K1

Số phần tương tự - MC100LE310

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Motorola, Inc	MC100LVE111	88Kb / 5P	LOW-VOLTAGE 1:9 DIFFERENTIAL ECL/PECL CLOCK DRIVER
ON Semiconductor	MC100LVE111	64Kb / 8P	LOW-VOLTAGE 1:9 DIFFERENTIAL ECL/PECL CLOCK DRIVER April, 2002 ??Rev. 5
	MC100LVE111	130Kb / 8P	3.3V ECL 1:9 Differential Clock Driver November, 2006 ??Rev. 7
	MC100LVE111FN	64Kb / 8P	LOW-VOLTAGE 1:9 DIFFERENTIAL ECL/PECL CLOCK DRIVER April, 2002 ??Rev. 5
	MC100LVE111FN	130Kb / 8P	3.3V ECL 1:9 Differential Clock Driver November, 2006 ??Rev. 7

More results

Mô tả tương tự - MC100LE310

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
ON Semiconductor	MC100E310	133Kb / 8P	5V ECL Low Voltage 2:8 Differential Fanout Buffer October, 2006 ??Rev. 5
Analog Devices	HMC6832	924Kb / 23P	Low Noise, 2:8 Differential Fanout Buffer
ON Semiconductor	MC100LVEL11	83Kb / 3P	Low Voltage 1:2 Differential Fanout Buffer 1996 Rev 0
	MC100E310	161Kb / 8P	5 V ECL Low Voltage 2:8 Differential Fanout Buffer July, 2016 ??Rev. 7
	MC100LVE310	128Kb / 7P	3.3V ECL 2:8 Differential Fanout Buffer November, 2006 ??Rev. 4
Micrel Semiconductor	SY100E310L	75Kb / 6P	3.3V ECL/PECL 2:8 DIFFERENTIAL FANOUT BUFFER
Micrel Semiconductor	SY100E310L_0607	71Kb / 6P	3.3V ECL/PECL 2:8 DIFFERENTIAL FANOUT BUFFER
ON Semiconductor	MC100LVE310	158Kb / 7P	3.3 V ECL 2:8 Differential Fanout Buffer July, 2016 ??Rev. 6
ON Semiconductor	MC10EP11	85Kb / 8P	1:2 Differential Fanout Buffer November, 2003 ??Rev. 6
Motorola, Inc	MC10EL11	61Kb / 3P	1:2 DIFFERENTIAL FANOUT BUFFER

More results

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