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Giải thích chi tiết về linh kiện  첨2/4, 첨4./5/6 Clock Generation Chip
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© Semiconductor Components Industries, LLC, 1999
December, 1999 – Rev. 1
1
Publication Order Number:
MC100EP139/D
MC100EP139
Product Preview
÷2/4, ÷4/5/6 Clock
Generation Chip
The MC100EP139 is a low skew
÷2/4, ÷4/5/6 clock generation chip
designed explicitly for low skew clock generation applications. The
internal dividers are synchronous to each other, therefore, the common
output edges are all precisely aligned. The device can be driven by
either a differential or single–ended ECL or, if positive power supplies
are used, LVPECL input signals. In addition, by using the VBB output,
a sinusoidal source can be AC coupled into the device. If a
single–ended input is to be used, the VBB output should be connected
to the CLK input and bypassed to ground via a 0.01
µF capacitor.
The common enable (EN) is synchronous so that the internal
dividers will only be enabled/disabled when the internal clock is
already in the LOW state. This avoids any chance of generating a runt
clock pulse on the internal clock when the device is enabled/disabled
as can happen with an asynchronous control. The internal enable
flip–flop is clocked on the falling edge of the input clock, therefore, all
associated specification limits are referenced to the negative edge of
the clock input.
Upon startup, the internal flip–flops will attain a random state;
therefore, for systems which utilize multiple EP139s, the master reset
(MR) input must be asserted to ensure synchronization. For systems
which only use one EP139, the MR pin need not be exercised as the
internal divider design ensures synchronization between the
÷2/4 and
the
÷4/5/6 outputs of a single device. All VCC and VEE pins must be
externally connected to power supply to guarantee proper operation.
50ps Output–to–Output Skew
PECL mode: 3.0V to 5.5V VCC with VEE = 0V
ECL mode: 0V VCC with VEE = –3.0V to –5.5V
Synchronous Enable/Disable
Master Reset for Synchronization of Multiple Chips
Q Output will default LOW with inputs open or at VEE
ESD Protection: >2KV HBM, >100V MM
VBB Output
New Differential Input Common Mode Range
Moisture Sensitivity Level 2
For Additional Information, See Application Note AND8003/D
Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
Transistor Count = 758 devices
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
TSSOP–20
DT SUFFIX
CASE 948E
http://onsemi.com
Device
Package
Shipping
ORDERING INFORMATION
MC100EP139DT
TSSOP
75 Units/Rail
MARKING DIAGRAM
MC100EP139DTR2
TSSOP
2500 Tape/Reel
SO–20
DW SUFFIX
CASE 751D
MC100EP139DW
SOIC
38 Units/Rail
MC100EP139DWR2
SOIC
2500 Tape/Reel
*For additional information, see Application Note
AND8002/D
KEP
139
ALYW
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
MC100EP139
AWLYWW
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week


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