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SSOP OR VSSOP PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

NC1

COM1

IN2

GND

COM2

IN1

NC2

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

GND

IN1

COM2

2

3

4

8

7

5

6

IN2

COM1

NC1

NC2

1

DESCRIPTION/ORDERING INFORMATION

TS5A23167

0.9-

Ω DUAL SPST ANALOG SWITCH

5-V/3.3-V 2-CHANNEL ANALOG SWITCH

SCDS195 – MAY 2005

•

Cell Phones

•

•

PDAs

•

Low ON-State Resistance (0.9

Ω)

•

Portable Instrumentation

•

Control Inputs Are 5.5-V Tolerant

•

Audio and Video Signal Routing

•

Low Charge Injection

•

Low-Voltage Data Acquisition Systems

•

Low Total Harmonic Distortion (THD)

•

Communication Circuits

•

1.65-V to 5.5-V Single-Supply Operation

•

Modems

•

Latch-Up Performance Exceeds 100 mA Per

•

Hard Drives

JESD 78, Class II

•

Computer Peripherals

•

ESD Performance Tested Per JESD 22

•

Wireless Terminals and Peripherals

– 2000-V Human-Body Model(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V

to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD)

performance and consumes very low power. These features make this device suitable for portable audio

applications.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

Tape and reel

TS5A23167YEPR

PACKAGE PREVIEW

0.23-mm Large Bump – YEP

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Tape and reel

TS5A23167YZPR

PACKAGE PREVIEW

–40

°C to 85°C

(Pb-free)

SSOP – DCT

Tape and reel

TS5A23167DCTR

PACKAGE PREVIEW

VSSOP – DCU (Pb-free)

Tape and reel

TS5A23167DCUR

JAP_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The acutal top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.