FN6239 Rev 2.00

Page 7 of 7

September 28, 2009

ISL21032

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Small Outline Transistor Plastic Packages (SOT23-3)

D

e1

E

CL

e

b

CL

A2

A

A1

CL

0.20 (0.008) M

0.10 (0.004) C

C

-C-

SEATING

PLANE

12

3

4

5

6

E1

CL

C

VIEW C

VIEW C

L

R1

R

4X

1

4X

1

GAUGE PLANE

L1

SEATING



L2

C

PLANE

c

BASE METAL

WITH

c1

b1

PLATING

b

P3.064

3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.035

0.044

0.89

1.12

-

A1

0.001

0.004

0.013

0.10

-

A2

0.035

0.037

0.88

0.94

-

b

0.015

0.020

0.37

0.50

-

b1

0.012

0.018

0.30

0.45

-

c

0.003

0.007

0.085

0.18

6

c1

0.003

0.005

0.08

0.13

6

D

0.110

0.120

2.80

3.04

3

E

0.083

0.104

2.10

2.64

-

E1

0.047

0.055

1.20

1.40

3

e

0.0374 Ref

0.95 Ref

-

e1

0.0748 Ref

1.90 Ref

-

L

-

0.016

0.21

0.41

4

L1

0.024 Ref

0.60 Ref

-

L2

0.010 Ref

0.25 Ref

-

N3

3

5

R

0.004

-

0.10

-

-

R1

0.004

0.010

0.10

0.25

-

a

0°

8°

0°

8°

-

Rev. 1 11/06

NOTES:

1. Dimensioning and tolerance per ASME Y14.5M-1994.

2. Package conforms to EIAJ SC-74 and JEDEC MO178AB.

3. Dimensions D and E1 are exclusive of mold flash, protrusions,

or gate burrs.

4. Footlength L measured at reference to gauge plane.

5. “N” is the number of terminal positions.

6. These Dimensions apply to the flat section of the lead between

0.08mm and 0.15mm from the lead tip.

7. Controlling dimension: MILLIMETER. Converted inch

dimensions are for reference only

8. Die is facing up for mold die and trim-form.