ISL12022MIBZ datasheet(6/32 Pages) RENESAS

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ISL12022M

FN6668 Rev 9.00

Page 6 of 32

June 20, 2012

Absolute Maximum Ratings

Thermal Information

Voltage on VDD, VBAT and IRQ/FOUT pins

(Respect to Ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V

Voltage on SCL and SDA pins

(Respect to Ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V

ESD Rating

Human Body Model (Per MIL-STD-883 Method 3014) . . . . . . . . . . >3kV

Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300V

Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2200V

Latch-up (Tested per JESD-78B, Class 2, Level A . . . . . . . . . . . . . . . 100mA

Shock Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . 5000g, 0.3ms, 1/2 sine

Vibration (Ultrasound Cleaning Not Advised) . . . . . . . . . . 20g/10-2000Hz

Thermal Resistance (Typical)

JA (°C/W)

JC (°C/W)

20 Lead SOIC (Notes 4, 5). . . . . . . . . . . . . . 70

35

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C

Pb-Free Reflow Profile (Note 6). . . . . . . . . . . . . . . . . . . . . . . . see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product

reliability and result in failures not covered by warranty.

NOTES:

4.

JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

5. For

JC, the “case temp” location is on top of the package and measured in the center of the package between pins 6 and 15.

6. The ISL12022M Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on the reflow temperature

and length of exposure. A general rule is to use only one reflow cycle and keep the temperature and time as short as possible. Changes on the order

of ±1ppm to ±3ppm can be expected with typical reflow profiles.

DC Operating Characteristics RTC Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise stated. Boldface

limits apply over the operating temperature range, -40°C to +85°C.

SYMBOL

PARAMETER

CONDITIONS

MIN

(Note 7)

TYP

(Note 8)

MAX

(Note 7)

UNITS

NOTES

VDD

Main Power Supply

(Note 15)

2.7

5.5

V

VBAT

Battery Supply Voltage

(Note 15)

1.8

5.5

V9

IDD1

Supply Current. (I2CNot Active,

Temperature Conversion Not Active, FOUT

Not Active)

VDD = 5V

4.1

15

µA

10, 11

VDD = 3V

3.5

14

µA

10, 11

IDD2

Supply Current. (I2C Active, Temperature

Conversion Not Active, Fout Not Active)

VDD = 5V

200

500

µA

10, 11

IDD3

Supply Current. (I2CNot Active,

Temperature Conversion Active, FOUT Not

Active)

VDD = 5V

120

400

µA

10, 11

IBAT

Battery Supply Current

VDD = 0V, VBAT = 3V, TA = +25°C

1.0

1.6

µA

10

VDD = 0V, VBAT = 3V

1.0

5.0

µA

10

IBATLKG

Battery Input Leakage

VDD = 5.5V, VBAT = 1.8V

100

nA

ILI

Input Leakage Current on SCL

VIL = 0V, VIH = VDD

-1.0

±0.1

1.0

µA

ILO

I/O Leakage Current on SDA

VIL = 0V, VIH = VDD

-1.0

±0.1

1.0

µA

VBATM

Battery Level Monitor Threshold

-100

+100

mV

VPBM

Brownout Level Monitor Threshold

-100

+100

mV

VTRIP

VBAT Mode Threshold

(Note 15)

2.0

2.2

2.4

V

VTRIPHYS VTRIP Hysteresis

30

mV

13

VBATHYS VBAT Hysteresis

50

mV

13

Số phần tương tự - ISL12022MIBZ

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