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DAC8811 bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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DAC8811 bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 15 page www.ti.com ABSOLUTE MAXIMUM RATINGS DAC8811 SLAS411A – NOVEMBER 2004 – REVISED DECEMBER 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MINIMUM RELATIVE DIFFERENTIAL PACKAGE- SPECIFIED TRANSPORT ACCURACY NONLINEARITY LEAD TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) (DESIGNATOR) RANGE MARKING NUMBER QUANTITY DAC8811C ±1 ±1 MSOP-8 (DGK) -40 °C to +85°C D11 DAC8811ICDGKT Tape and Reel, 250 DAC8811C ±1 ±1 MSOP-8 (DGK) -40 °C to +85°C D11 DAC8811ICDGKR Tape and Reel, 2500 DAC8811C ±1 ±1 SON-8 (DRB) -40 °C to +85°C D11 DAC8811ICDRBT Tape and Reel, 250 DAC8811C ±1 ±1 SON-8 (DRB) -40 °C to +85°C D11 DAC8811ICDRBR Tape and Reel, 2500 DAC8811B ±2 ±1 MSOP-8 (DGK) -40 °C to +85°C D11 DAC8811IBDGKT Tape and Reel, 250 DAC8811B ±2 ±1 MSOP-8 (DGK) -40 °C to +85°C D11 DAC8811IBDGKR Tape and Reel, 2500 DAC8811B ±2 ±1 SON-8 (DRB) -40 °C to +85°C D11 DAC8811IBDRBT Tape and Reel, 250 DAC8811B ±2 ±1 SON-8 (DRB) -40 °C to +85°C D11 DAC8811IBDRBR Tape and Reel, 2500 (1) For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or refer to our web site at www.ti.com. over operating free-air temperature range (unless otherwise noted)(1) DAC8811 UNIT VDD to GND -0.3 to +7 V Digital input voltage to GND -0.3 to +VDD + 0.3 V V (IOUT) to GND -0.3 to +VDD + 0.3 V Operating temperature range -40 to +105 °C Storage temperature range -65 to +150 °C Junction temperature range (TJ max) +125 °C Power dissipation (TJ max - TA) / RΘJA Thermal impedance, RΘJA 55 °C/W Lead temperature, soldering Vapor phase (60s) 215 °C Lead temperature, soldering Infrared (15s) 220 °C ESD rating, HBM 1500 V ESD rating, CDM 1000 V (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 |
Số phần tương tự - DAC8811 |
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Mô tả tương tự - DAC8811 |
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