LANSDALE Semiconductor, Inc.

ML12040

www.lansdale.com

Page 5 of 5

Issue 0

P DIP 14 = CP

PLASTIC PACKAGE

(ML12040CP)

CASE 646–06

ISSUE M

17

14

8

B

A

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.715

0.770

18.16

18.80

B

0.240

0.260

6.10

6.60

C

0.145

0.185

3.69

4.69

D

0.015

0.021

0.38

0.53

F

0.040

0.070

1.02

1.78

G

0.100 BSC

2.54 BSC

H

0.052

0.095

1.32

2.41

J

0.008

0.015

0.20

0.38

K

0.115

0.135

2.92

3.43

L

M

–––

10

–––

10

N

0.015

0.039

0.38

1.01

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

F

HG

D

K

C

SEATING

PLANE

N

–T–

14 PL

M

0.13 (0.005)

L

M

J

0.290

0.310

7.37

7.87

OUTLINE DIMENSIONS

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.

PLCC 20 = -4P

CASE 775-02

Plastic Package

(ML12040-4P)