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CD0865A bảng dữ liệu(PDF) 3 Page - TT Electronics. |
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CD0865A bảng dữ liệu(HTML) 3 Page - TT Electronics. |
3 / 4 page CHC Series Issue April 2011 Sheet 3 of 4 • 4222 South Staples Street • Corpus Christi Texas 78411 USA © IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Physical Data and Schematic Diagrams for 1.0mm Pitch Series 0.64mm ±0.05 diameter solder bumps 1.00mm ±0.25mm 4.0mm ±0.15mm 0.63m m ±0.1mm 0.50mm ±0.25mm 1.00mm ±0.25mm 9.00mm ±0.15mm 1 2 3 9 8 7 6 5 4 1.27m m ±0.16mm 1 2 3 4 5 6 7 8 9 D C B A 1 2 3 4 5 6 7 8 9 D C B A CD0910A isolated schematic (view from top) CD0910B bussed schematic (view from top) 1.00m m ±0.25mm 3.0m m ±0.15mm 0.50mm ±0.25mm 1.00m m ±0.25mm 9.00m m ±0.15mm 1 2 3 9 8 7 6 5 4 0.63m m ±0.1mm 1.27m m ±0.16m m 0.64mm ±0.05 diameter solder bump s 1 2 3 4 5 6 7 8 9 C B A 1 2 3 4 5 6 7 8 9 C B A CC0910A isolated schematic (view from top) CC0910B bussed schematic (view from top) Ceramic Ball Grid Termination Arrays Environmental Test Specification Typical Maximum Thermal shock MIL-PRF-83401 ±0.01% ±0.02% Low temperature operation MIL-PRF-83401 ±0.01% ±0.05% Short time overload MIL-PRF-83401 ±0.01% ±0.05% High temperature exposure MIL-PRF-83401 ±0.03% ±0.05% Effects of solder MIL-PRF-83401 ±0.01% ±0.05% Moisture resistance MIL-STD-202, Method 206 65°C, 45% RH, with bias ±0.02% ±0.01% Life MIL-PRF-83401 ±0.01% ±0.02% Environmental Data Note: Contact A1 indicator marked with dot on top of part. Coplanarity between solder bumps 0.06mm. Ceramic Ball Grid Termination Arrays CHC Series BI Technologies IRC Welwyn 07.14 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors |
Số phần tương tự - CD0865A |
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Mô tả tương tự - CD0865A |
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