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LMZM33603 bảng dữ liệu(PDF) 5 Page - Texas Instruments |
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LMZM33603 bảng dữ liệu(HTML) 5 Page - Texas Instruments |
5 / 30 page 5 LMZM33602 www.ti.com SNVSAO4 – DECEMBER 2017 Product Folder Links: LMZM33602 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 63 mm × 63 mm double-sided PCB with 2 oz. copper and natural convection cooling. Additional airflow reduces RθJA. (3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. (4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. 6.4 Thermal Information THERMAL METRIC(1) LMZM33602 UNIT RLR (QFN) 18 PINS RθJA Junction-to-ambient thermal resistance(2) 18.9 °C/W ψJT Junction-to-top characterization parameter(3) 2.0 °C/W ψJB Junction-to-board characterization parameter(4) 6.2 °C/W (1) See Voltage Dropout for information on voltage dropout. (2) The overall output voltage tolerance will be affected by the tolerance of the external RFBT and RFBB resistors. 6.5 Electrical Characteristics Over –40°C to +105°C ambient temperature, VIN = 24 V, VOUT = 5 V, IOUT = IOUT maximum, fsw = 450 kHz (unless otherwise noted); CIN1 = 2 × 4.7-µF, 50-V, 1210 ceramic; CIN2 = 100-µF, 50-V, electrolytic; COUT = 4 × 22-µF, 25-V, 1210 ceramic. Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely parametric norm and are provided for reference only. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT VOLTAGE (VIN) VIN Input voltage Over IOUT range 4(1) 36 V UVLO VIN undervoltage lockout VIN increasing 3.3 3.6 3.9 V VIN decreasing 3 3.3 3.5 V ISHDN Shutdown supply current VEN = 0 V 2 4 µA OUTPUT VOLTAGE (VOUT) VOUT(ADJ) Output voltage adjust Over IOUT range 1 18 V VOUT(Ripple) Output voltage ripple 20-MHz bandwidth 10 mV FEEDBACK VFB Feedback voltage(2) TA = 25°C, IOUT = 0 A 0.985 1 1.015 V Over VIN range, –40°C ≤ TJ ≤ 125°C, IOUT = 0 A 0.98 1 1.02 V Load regulation Over IOUT range, TA = 25°C 0.04% IFB Feedback leakage current VFB = 1 V 10 nA CURRENT IOUT Output current Natural convection, TA = 25°C 0 2 A Overcurrent threshold 3.6 A PERFORMANCE ƞ Efficiency VIN = 24 V, IOUT = 1 A VOUT = 12 V, fSW = 900 kHz 94% VOUT = 5 V, fSW = 450 kHz 90% VOUT = 3.3 V, fSW = 300 kHz 88% VIN = 12 V, IOUT = 1 A VOUT = 5 V, fSW = 450 kHz 93% VOUT = 3.3 V, fSW = 300 kHz 91% VOUT = 2.5 V, fSW = 250 kHz 89% Transient response 25% to 75% load step 1 A/µs slew rate Over/undershoot 90 mV Recovery time 55 µs |
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